Low power consumption and small footprint as former Atom series

 

AMB-N280S1, which carries Intel dual- core 1.8 GHz Atom Processor N2800. Acrosser takes advantage of Atom Cedar Trail N2000 series processor in design, such as low power consumption and small footprint as former Atom series.

AMB-N280S1 can support both two displays to maximum resolution 1920 x 1200. It also offers the 18-bit LVDS interface for small size LCD panel.

AMB-N280S1 Features
‧ Intel Atom N2800 1.86GHz
‧ 1 x DDR3 SO-DIMM up to 4GB
‧ 1 x VGA
‧ 1 x HDMI
‧ 1 x 18-bit LVDS
‧ 4 x USB2.0
‧ 6 x COM (5 x RS-232, 1 x RS-232/485)

The world's biggest exhibition Embedded world Exhibition

The embedded world Exhibition&Conference is the world's biggest exhibition of its kind and the meeting-place of the international embedded community. Embedded technologies are in action everywhere - whether in the car, data and telecommunication systems, industrial and consumer electronics, military systems or aerospace. 872 exhibitors showed 22,262 qualified visitors the full range of products for embedded technologies in 2012: hardware, software, tools, services and lots more.

Embedded world, the biggest and most important event of its kind, opens the series of high-tech exhibitions and knowledge-packed events at the Nürnberg venue from 26–28 February 2013. This event sets standards and records every year – now for the eleventh time in 2013. Exhibitors from all over the world present the entire spectrum of embedded systems: hardware, software, tools and services. “The embedded world Exhibition&Conference is growing continuously and rapidly in the same way that the embedded sector is gaining in importance – the embedded community can look forward to a record event,” says Alexander Mattausch, Exhibition Manager of embedded world. The specialists can also look forward once again to figures such as Prof. Nicholas McGuire or Dr. David Kalinsky, who have given the embedded world Conference a face, weight, spirit and know-how at a high professional standard for years. The electronic displays Conference is every bit as good. Stuart McClure, President and CEO of Cylance, opens embedded world on the first day with his keynote on “Safety and Security”.
Acrosser ------> Booth Hall 2 2-519

refer:
http://www.embedded-world.de/en/press/

COM Express Basic Type 6 Module with Fan heatsink

ACM-B6360 carries on board Intel 3rd gnenration Core i7-3615QE FCBGA1023 processor which supports three independent display with multiple output : 24-bit LVDS, VGA, HDMI and one DDI interface.
ACM-B6360 is base on COM Express Type 6 pin-out design and supports two DDR3-1333 SO-DIMM socket with ECC and four native USB 3.0 ports.

Key features:
1. COM Express Basic Type 6 Module with Fan heatsink
2. Onboard Intel 3rd Generation Core i7-3615QE BGA processor.
3. Two DDR3 SO-DIMM sockets with ECC supportted, up to 16G
4. Supports 3 independent display output
5. 1 x PCI-E x16 Gen.3, 7x PCI-E x1 interfaces
6. 2 x SATAIII ports, 2 x SATAII ports
7. 4 x USB 3.0 ports, 4 x USB 2.0 ports
8. 1 x GbE, I2C, SMBus, LPC interface

Network Security Appliance with Intel’s 2nd Generation Core Processor

its high-end Network Security Platform AR-R6102 series. The AR-R6102 is built on Intel C206 Cougar Point platform. It delivers dependability and productivity by providing new levels of cost effective data protection, performance, expanded security, virtualization, and power management options. AR-R6102 supports scalable range of Intel® Xeon, Core i, Pentium and Celeron processors. Beside the 6 on board Giga bits Ethernet ports, it also provides two Network Interface Card (NIC) slots which are provides flexibility of accommodate up to two 4 ports Gb Ethernet, 4 ports Gb Fiber or 2 ports 10 Gb fiber NICs. The 2U version AR-R6102B has 5 more disk bay to support the RADI 0/1/5 function and provides the option of redundant power supplies. The ECC memory modules are supported for better reliability when Xeon processor is used.

 Main Features:

1.    Support Intel’s Core i & Xeon  Processors
2.    Support 4 x ECC/non-ECC DDR3 1066/1333 SO-DIMM slots , Max. 32GB Memory
3.    2 expansion slots for extra copper/fiber LAN modules
4.    Up to 6 disk bay for RAID 0/1/5
5.    Optional redundant power supply.

Networking with Intel ATOM dual-core D525 processor

The AR-R6006 carrys Intel ATOM dual-core D525 processor which supports Hyper Threading Technology and Intel 64 architecture with low power consumption. Enhanced low-power states allow designers to further minimize overall power consumption. They can deliver more efficient use of processor resources, higher processing throughput and improved performance on applications.

 

Key features:
‧ 1U Rack Mount chassis
‧ Low power Intel ATOM D525 Dual Core processor 1.8 GHz+ ICH8M
‧ Two DDR3 SO-DIMM support up to 4GB (unbuffered and non-ECC dimm)
‧ 6 x Intel 82574L GbE Ethernet with 2 pair LAN Bypass Function
‧ 1 x 2.5”/3.5” SATA HDD Bay, 1 x CF Type II socket
‧ 2 x USB 2.0 ports in front
‧ 1 x Mini-PCI slot, 1 x RJ45 for Console

Fanless Embedded System AR-ES5231FL with Celeron M

ACROSSER chose the Intel® 910GMLE chipset and Celeron M 1GHz CPU. We believe it is a good choice for the customer seeking a low cost and average performance solution. It has passed CE/FCC pre-scans, along with ACROSSER’s strict thermal and vibration testing.

 

AR-ES5231FL includes one SO-DIMM socket for maximum of 1GB System Memory. It uses AC power adapter to furnish DC 12V. AR-ES5231FL’s fanless design reduces failures due to CPU and systems fans, thus increasing the product life and reliability significantly. With its small size (16.5 x 25 x 6.7 cm) and wall mounting kit, the unit easily fits into any application. Its PCI-104 expansion slot provides many options for all kinds of 104 modules to meet specific project needs.

 

embedded system ,in vehicle computer ,Industrial PC

Single Board Computer Mini-ITX AMB-QM77T1

The AMB-QM77T1 is the newest Mini-ITX industrial mainboard from Acrosser Technology .


AMB-QM77T1 has two DDR3 SO-DIMM sockets to support up to 16GB of system memory. Onboard 24-bit dual channel LVDS interface support big size LCD panel directly made it suitable for digital signage and panel PC applications. It also features advanced technologies including four USB 3.0 and two SATA III connectivity to deliver high speed data transmission.

The Intel 3rd generation mobile processors supported by the AMB-QM77T1 features an integrated GPU, which is capable of supporting such graphical libraries as DirectX11, OpenGL4.0 and OpenCL1.1. Targeting on multimedia and gaming applications, AMB-QM77T1 brings enhanced graphics performance by supporting 3 independent displays in any combination of VGA, HDMI, LVDS and DVI output.

 

 

The key features of the AMB-QM77T1 include:

‧  Intel QM77 chipset
‧  FCPGA socket supports 3rd Generation Intel® Core(TM) i7/i5/i3 processors and Celeron
‧  2* DDR3-1600/1333/1066 SO-DIMM up to 16GB
‧  Supports VGA/DVI-D/HDMI/LVDS displays
‧  Support 3 independent display
‧  Dual Intel PCI-E Gigabit LAN
‧  8* USB 2.0, 4* USB 3.0, 3* COM, 3* SATA II, 2* SATA III
‧  1* PCI-E x16, 1* Mini PCI-E, 1* CFast socket
‧  iAMT 8.0, TPM 1.2, Watchdog timer, Digital I/O Support VGA and DVI output